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20 layer interconnection PCB

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Shenzhen Jiaqing Circuit Co., Ltd.

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20 layer interconnection PCB

Payment Terms : L/C,D/A,D/P,T/T

Layers : 20

Lamination Cycles : 9

Price : negotiate

Board Thickness : 2.8mm

Model Number : 20 layer interconnection PCB

Copper Thickness : 1oz

Packaging Details : Vakuumverpackung + Antistatikbeutel, Trockenmittel, Temperaturanzeigekarte, Karton

MOQ : 1PCS

Delivery Time : 5-15 Werktage, Eilbestellung möglich

Via Type : Stacked Microvia (Any Layer)

Brand Name : JQPCB

Min. Line Width : 3/3mil

Supply Ability : 20000 Quadratmeter / Monat

Material : FR4 TG180

Min. Hole Size : 0.1mm

Certification : ISO 9001, IPC Class II/III

Surface Finish : ENIG / HASL / OSP

Place of Origin : China

Application : Server / Telecom / Aerospace

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This is a 20-layer HDI PCB with any layer interconnection structure, manufactured via 9 lamination cycles, finished board thickness 2.8mm. Adopting stacked microvias technology, it realizes electrical connection between arbitrary layers, delivering ultra-high wiring density and stable high-speed signal performance.

This 20-layer any layer HDI PCB is widely used in high-speed servers, data communication equipment, high-end network switches, radar, aerospace and high-reliability industrial control systems. The any-layer stacked microvia structure greatly improves wiring density, shortens signal transmission path, reduces signal loss and crosstalk, ensuring stable high-speed signal integrity under high-frequency working conditions. It can help customers miniaturize device size while maintaining excellent electrical performance.

We support customized stack-up design, various surface finishes including ENIG, HASL, OSP, Hard Gold, Immersion Silver. Strictly produced per IPC-A-600 standards. Available for prototype, small batch and mass production.

20 layer interconnection PCB

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