Core Advantages of Shengyi Tg180 16-Layer Castellated Hole PCB
✅ Substrate Advantages: Shengyi Tg180 FR4
Super High Thermal Resistance (Tg≥180℃) Compared with conventional Tg140 and Tg170 substrates, Shengyi Tg180 material resists softening, delamination and blistering under high-temperature conditions. It maintains excellent stability during multiple lead-free reflow soldering and long-duration high-temperature operation, perfectly suitable for continuously heated circuit boards of laser equipment and industrial control systems.
Stable Electrical Performance (Dk≈4.4, Df ≤0.025) The substrate features stable dielectric constant and low dissipation factor with minor parameter fluctuation. It enables high pass rate of controlled impedance design and guarantees excellent high-speed signal integrity, fully meeting the high-speed signal transmission requirements of industrial control and embedded systems.
Excellent Mechanical Reliability It owns a lower coefficient of thermal expansion (CTE), resulting in minimal deformation under temperature variation. For 16-layer thick PCBs, the material effectively avoids layer offset and delamination during multi-layer lamination, greatly extending the service life of circuit boards.
Eco-Friendly & Export Compliant Halogen-free version is available, fully complying with RoHS and REACH standards, supporting barrier-free export to European and American markets.
✅ Structural & Process Advantages: 16-Layer Design
Abundant Power & Ground Plane Layout Multiple independent GND and power planes can be arranged with flexible power division. It effectively reduces signal crosstalk and noise, delivering strong anti-interference performance, which is ideal for high-density BGA and complex chip applications.
High-Density Wiring Capacity The 16-layer structure provides sufficient wiring space for BGA fan-out and differential pair routing. It integrates complex main control, storage and interface circuits on a single PCB, realizing miniaturization of module products.
Optimized Signal Integrity Signal layers are closely attached to ground layers to form an effective shielding structure, which greatly reduces EMI electromagnetic interference — a critical advantage for laser mainboards and industrial control equipment.
✅ Castellated Hole Process Advantages
Edge Soldering & Modular Design Exposed copper rings of edge castellated holes allow direct soldering to the mainboard. This structure eliminates the need for additional connectors, simplifies module assembly procedures and reduces overall BOM cost.
Reinforced Mechanical Connection & Shock Resistance Castellated hole soldering realizes dual functions of electrical connection and mechanical fixation. It offers better shock resistance than traditional gold fingers, adapting to the vibrating working environment of industrial and laser equipment.
